Courses on Advanced Topic IV - MEMS
12 - 13 December 2019
CEITEC BUT, Purkyňova 123, S building, large meeting room
Topics of the two-day course
- Microfabrication Techniques (U. Schmid)
- Introduction to Specific Markets and Applications of MEMS (Literature, Definition, Driving forces for MEMS development, MEMS market figures and manufacturers, MEMS products for automotive applications)
- Materials Standard materials in MEMS (Why silicon for MEMS fabrication, Properties of MEMS materials, Fabrication process of high quality silicon, Piezoresistive effect in Silicon)
- MEMS Technologies (Clean room, Thin film techniques (CVD, PVD, oxidation), Doping techniques (diffusion, ion implantation), Lithography, Etching techniques (wet etching, dry etching))
- Technology Platforms (Bulk- and surface micromachining, LIGA)
- Some Selected MEMS Devices (Pressure sensors, flow sensors, acceleration sensors, gyroscopes)
- Piezoelectric MEMS Materials and Devices (M. Schneider)
- Introduction to piezoelectricity (Fundamental principles, mathematical description)
- Piezoelectric materials (Commonly used materials (AlN, doped AlN, PZT, PVDF,…))
- Piezoelectric MEMS devices (Resonators, buckled membranes, acoustic wave devices)
- Silicon Carbide (SiC) based MEMS for Harsh Environments (G. Pfusterschmied)
Introduction to silicon carbide (Historical evolution, Fundamental material properties, Polytypism)
Deposition techniques (SiC bulk materials and thin films)
SiC-based devices
- Modelling and Simulation of MEMS (D. Platz)
- Continuum Mechanics (Linear elasticity, Fluid dynamics)
- Models for basics MEMS structures (Euler Bernoulli beam theory, Kirchhoff plate theory)
- Linear and nonlinear dynamics (Vibrational eigenmodes, Harmonic oscillator, Nonlinear oscillators)
Program
(each block consist of approx. 2-hour lecture interspesed with one short coffee break)
12 Dec (Thursday)
9:15 - 11:30 - Microfabrication techniques (U. Schmid)
lunch break
13:00 - 15:15 - Piezoelectric MEMS Materials and Devices (M. Schneider)
13 Dec (Friday)
9:15 - 11:30 - SiC-based MEMS for Harsh Environments (G. Pfusterschmied)
lunch break
13:00 - 15:15 - Modelling and Simulations of MEMS (D. Platz)